DIN V 16566-1-2004 电子商务.第1部分:核心元素的技术规范(ebXML框架的第8部分)
时间:2024-05-02 10:23:14 来源: 标准资料网 作者：标准资料网 阅读：8277
【英文标准名称】:ElectronicBusiness-Part1:CoreComponentsTechnicalSpecification(Part8oftheebXMLFramework)
【原文标准名称】:电子商务.第1部分:核心元素的技术规范(ebXML框架的第8部分)
【标准号】:DINV16566-1-2004
【标准状态】:现行
【国别】:德国
【发布日期】:2004-02
【实施或试行日期】:
【发布单位】:德国标准化学会(DIN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:经济学;数据处理;数据传送;传输;EDI;商业数据交换;电子数据交换;商业;电子商务;铸模;因特网;行政管理、商业和运输用电子数据交换;可扩展标记语言;文电;方法论;数据传输;管理;商务程序;商务行为;运输;XML;程序设计语
【英文主题词】:
【摘要】:Thispre-standarddescribesandspecifiesanewapproachtothewell-understoodproblemofthelackofinformationinteroperabilitybetweenapplicationsinthee-businessarena.Thecorecomponentssolutiondescribesamethodologyfordevelopingacommonsetofsemanticbuildingblocksthatrepresentthegeneraltypesofbusinessdataandprovidesforthecreationofnewbusinessvocabulariesandrestructuringofexistingbusinessvocabularies.
【中国标准分类号】:A11
【国际标准分类号】:35_240_60
【页数】:103P;A4
【正文语种】:德语
【英文标准名称】:Printedboardassemblies-EvaluationcriteriaforvoidsinsolderedjointsofBGAandLGAandmeasurementmethods
【原文标准名称】:印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准
【标准号】:BSEN61191-6-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2010-05-31
【实施或试行日期】:2010-05-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:空腔;定义(术语);电气工程;电驱动装置;电子工程;电子设备及元件;电子装置;评定;测量;测量技术;印制电路;印制电路板;分规范;表面安装设备;焊接的;软钎焊连接;焊接;规范;规范(验收);表面安装;X射线;X射线分析
【英文主题词】:Cavity;Definitions;Electricalengineering;Electrically-operateddevices;Electronicengineering;Electronicequipmentandcomponents;Electronically-operateddevices;Evaluations;Measurement;Measuringtechniques;Printedcircuits;Printed-circuitboards;Sectionalspecification;SMD;Soldered;Solderedjoints;Solderings;Specification;Specification(approval);Surfacemounting;X-ray;X-rayanalysis
【摘要】:ThispartofIEC61191specifiestheevaluationcriteriaforvoidsonthescaleofthethermalcyclelife,andthemeasurementmethodofvoidsusingX-rayobservation.ThispartofIEC61191isapplicabletothevoidsgeneratedinthesolderjointsofBGAandLGAsolderedonaboard.ThispartofIEC61191isnotapplicabletotheBGApackageitselfbeforeitisassembledonaboard.Thisstandardisapplicablealsotodeviceshavingjointsmadebymeltandre-solidification,suchasflipchipdevicesandmulti-chipmodules,inadditiontoBGAandLGA.Thisstandardisnotapplicabletojointswithunder-fillbetweenadeviceandaboard,ortosolderjointswithinadevicepackage.Thisstandardisapplicabletomacrovoidsofthesizesoffrom10μmtoseveralhundredmicrometresgeneratedinasolderedjoint,butisnotapplicabletosmallervoids(typically,planarmicrovoids)withasizeofsmallerthan10μmindiameter.Thisstandardisintendedforevaluationpurposesandisapplicableto?researchstudies,?off-lineproductionprocesscontroland?reliabilityassessmentofassembly
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:42P.;A4
【正文语种】:英语
Product Code:SAE AMS4145
Title:Alumunim Alloy, Forgings, 12.2si 1.1mg 0.9cu 0.9ni (Cancelled Sep 1996)
Issuing Committee:Ams D Nonferrous Alloys Committee
Scope: This specification has been 'CANCELLED' by the Aerospace Materials Division, SAE, as of September 1996. Alloy: 4032-T6 UNS Number: A94032